Automated Optical inspection (AOI) imaging components on Semiconductor leadframe inspection are critical to ensure quality of wired bonded. High speed imaging is the need of today industry to cross check wire condition, misalignment of solder and wrong placement in both 2D and 3D configurations.
Color imaging supports defect inspection on leadframe by not only identify manufacturing defects but also identifying color of mounted die. Furthermore, 3D imaging guarantees measurement of critical parts such as wire placement, wire height, solder paste, die co-plane, ball bonding and others not capable of usign 2D alone.