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AP&S International GmbH

Donaueschingen,  Germany
http://www.ap-s.de
  • Booth: 944

Welcome to AP&S - Your partner for wet process euqipment!

Overview

AP&S International GmbH is a global-scale specialist for the development, construction, and refurbishment of wet-process technology. Tailored to be flexible, we offer customized solutions for etching, cleaning, coating and drying of wafers and substrates as well as necessary disposal systems. The product portfolio ranges from individual laboratory modules to fully automated wet chemical production facilities.

The market environment, in which AP&S is active in, is one of the fastest-evolving sectors of the world. For more than a decade, AP&S has successfully established itself in the market. Its international customer base belongs to various industrial fields such as semiconductor, opto-electronics, MEMS, display technology, and sensor technology. The core competence, cooperation with customers in the specifying and developing phase, and high availability of machinery and equipment as well as short response time and distance from customers make for a long-term success. Thus, maintaining network and service locations play a crucial role in the success of the company.


  Press Releases

  • The company based in Donaueschingen (Aasen) announces its entry into the US market. In response to customer inquiries from the USA, AP&S has now taken this step and hired its first employees in April.

    AP&S International GmbH builds wet process systems for the manufacture of microchips and is therefore active in the semiconductor industry. The USA remains a key market for German mechanical engineering and semiconductors have also become the focus of geopolitical interests. In addition, the "Chips Act" is attracting chip companies and suppliers to the USA.

    With a gross domestic product of around 27.97 trillion US dollars (2024), the USA is the largest economy in the world. The chances for companies in the land of opportunity are correspondingly great.

    One of the drivers of investment in the USA is the expected boom in electric cars. The production of SiC chips can guarantee a greater range and more efficient charging processes. This technology is also being strongly promoted in the USA.

    AP&S, which currently has 250 employees worldwide, has the know-how for market expansion thanks to over 20 years of expertise in the market. Most potential customers based in the USA already know the company from existing contracts with other locations around the world. This has already resulted in the first major order for five systems, which will be built for a customer in the USA by mid-2025.

    The systems ordered for the USA are both production supporting equipment and batch systems (several wafers* are processed at the same time), some standardized and some customized to customer requirements. In order to test and prepare customer processes realistically, the company has a DemoCenter in which laboratory tests are carried out so that the wet processes can then be prepared precisely for the system. Operators of the systems are trained in the in-house training center, the AP&S Academy, to prevent a shortage of skilled workers.

    Tobias Bausch, CMO&CTO of AP&S International GmbH, is now also responsible for the new location as CEO, AP&S US Inc. He and his employees will continue to expand the company there. "Opening up the US market is a major challenge but also an opportunity that we are very much looking forward to. The needs of our existing and new customers in the USA are very important to us and we will demonstrate the "Made in Germany" brand here with commitment and drive," says Tobias Bausch.

    For AP&S, this step is a milestone in its successful history since it was founded in 2003 by Horst Hall and Alexandra Laufer-Müller (CEO). "This step underlines our commitment to offering our customers worldwide first-class products and always being close to the market," says Alexandra Laufer-Müller.


  Products

  • NexAStep
    The fully automated high-throughput NexAStep platform offers more functions in a more compact space for maximum yield....

  • Main Benefits

    • Wafer-friendly transport and maximum speed during empty runs thanks to a highly dynamic axis system
    • Optimal use of the clean room due to compact design of the system and efficient arrangement of chemical supply, drains, receiver tanks and control cabinets in the module footprint
    • Modular concept enables fast assembly, disassembly and conversion
    • Uninterrupted production flow due to an integrated storage unit with up to 75 storage spaces
  • Vulcanio
    The high-throughput electroless wet bench for under-bump metallization (UBM) with nickel, palladium and gold....

  • Main Benefits

    • Specially developed and optimized for UBM (Under Bumping Metallization) of aluminum or copper pads (nickel, palladium, immersion gold)
    • Unique software and hardware features ensure exceptional deposition uniformity, bath longevity and an unbeatable operating cost ratio.
    • Process-specific analyzers and optimized metering ensure comprehensive process control and maximum reliability.
    • Read our article: Advanced under-bump metallization (UBM) with the AP&S e-less system Vulcanio - 7 unbeatable facts that are convincing
  • CleanSurF
    The purity guarantor for all common carrier types, boxes, SMIF pods and FOUPs....

  • Main Benefits

    • Optimum cleaning performance thanks to the newly developed nozzle concept with over 50 nozzles (DIW as well as N2 nozzles)
    • Attractive TcO values - very low consumption of water and nitrogen and extremely compact footprint of 3 m²
    • High loading capacity of up to 12 x 12 inch FOUPs per run
    • Latest software technology including HMI according to Semi II standard
    • Maximum flexibility - optimized for manual and automatic loading
    • Practical airlock function - loading on the cleanroom side and access to the service area on the grayroom side possible. Optionally, a lock function for cleanroom/grayroom separation is possible through a second process chamber door.

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