Defective products are detected in advance through testing before supplying individually packaged HBM, which is created by sawing HBM in wafer form.
ï‚· Fine-Pitch Test Interface: 0.16mm (Compared to conventional 0.3mm or 0.5mm)
ï‚· High-Precision Stage for HBM Device Alignment: ±5µm
ï‚· MEMS Socket Development and Compatibility
ï‚· Innovative Carrier-Free Automated Inspection Method
ï‚· Dual Hot & Cold Chuck
ï‚· Temperature Control Range: -45°C to +145°C