Welcome to the GMM & G2C+ Booth No#7531
Overview
The company’s core technology and related main products include precision pick-and-place technology for chip sorter machines and die-bonding machines; precision processing technology for punching forming machines and automatic sealing machines; photoelectric integration technology for laser marking machines and optical inspection machines, etc.
Formed in 2020, the G2C+ Alliance is a strategic partnership uniting C SUN, GPM, and GMM, bringing together the strengths of three industry leaders spanning semiconductors, display panels, and PCB manufacturing.
G2C+ delivers a true one-stop solution . As technology evolves at a rapid pace and market demands shift, the G2C+ Alliance stays ahead by driving innovation in high-barrier process equipment, focusing on advanced packaging, wafer regeneration, and beyond. It also encompasses cutting-edge applications, such as AI, high-performance computing (HPC), and next-generation communication chips, partnering with industry leaders to help shape the future of technology
https://g2cplus.com/en/introduce-our-partner/
Products