3D-Micromac AG

microPREP® PRO FEMTO is 3D-Micromac’s high-precision femtosecond laser ablation system for advanced sample preparation in semiconductor failure analysis & device characterization. Unlike mechanical polishing or ion beam milling, it uses ultrashort laser pulses for selective material removal with minimal thermal or mechanical impact. This enables fast, non-destructive cross-sectioning and delayering, especially for large areas or coarse removal, making it a powerful alternative or complement to FIB. The system handles a wide range of materials and geometries, including metals, semiconductors, ceramics, polymers, and composites. A user-friendly software with predefined workflows ensures reproducibility and seamless integration into SEM, TEM, APT, X-ray tomography, or micromechanical testing. By accelerating time-to-sample and reducing tool bottlenecks, microPREP PRO FEMTO increases throughput, lowers cost of ownership, and boosts lab efficiency—ideal for today’s complex semiconductor challenges.

Selective laser annealing enables targeted activation of functional layers with minimal thermal impact on surrounding structures – a key technology in advanced semiconductor production. Our systems offer outstanding process uniformity, repeatability, and efficiency at an industrial scale.

The microPRO XS OCF enables accurate activation of ohmic contacts on SiC wafers for power device applications. It delivers application-optimized annealing at the highest technological level while maintaining a low CoO.

Selective laser annealing enables targeted activation of functional layers with minimal thermal impact on surrounding structures – a key technology in advanced semiconductor production. Our systems offer outstanding process uniformity, repeatability, and efficiency at an industrial scale.

The award-winning microVEGA xMR precisely aligns magnetic layers for GMR and TMR sensors and is used worldwide in the high-volume production of monolithically integrated sensor chips.