Material Advantages:
1.Ultra-Chemical Resistance – Withstands aggressive acids (HF, HNO₃, HCl), solvents, and plasmas.
2.High-Temperature Stability – Operating range: -200°C to +250°C (PTFE) / +260°C (PFA).
3.Low Particulation – Near-zero particle shedding for contamination-sensitive processes.
4.Non-Stick Surface – Prevents wafer adhesion and residue buildup.
5.Excellent Dielectric Properties – Reduces electrostatic discharge (ESD) risks.
Customization Options:
--Size & Shape – Compatible with 8", 12" wafers or custom dimensions.
--Slot Design – Adjustable spacing, notch alignment, or edge-grip configurations.
--Special Features – Handles, ventilation holes, or stacking compatibility.