XYZTEC: the bond-test leader. Look to XYZTEC for Innovation
Overview
XYZTEC, is the leader in bond test innovation. Our rotating measurement unit (RMU) has eliminated the need for separate cartridges. We can mount up to 6 test sensors on the Sigma platform. This increases flexibility, speeds up test and eliminates maintenance/handling problems.
For 2016, XYZTEC will introduce the Sigma W12 to the US market. The W12 was designed to perform precision shear and cold-bump pull testing on wafers up to 300mm. We are also introducing our latest generation automation software for both our Condor Sigma and the Sigma W12. This software offers enhanced pattern recognition and image processsing capabilities. When combined with our standard automation and image capture system, customers can increase test speeds, improve accuracy and decrease operator errors. In the automation mode, the software scans for fiducial marks. After identifying their coordinates, the Sigma can begin a fully automated test sequence; including any sensor detected on the RMU.
Please see us in booth 1539.