Precitec 3D Metrology

Neu-Isenburg,  Hessen 
Germany
https://www.precitec.com/optical-3d-metrology/
  • Booth: 1261

Welcome to precision measurement in Semicon applications!

Overview

Precitec 3D Metrology – enabling precision from wafer to package

In everything from wafer production to device packaging, Precitec harnesses the power of light to offer state-of-the-art real-time measurement solutions in the sub-micro range based on chromatic confocal technology, interferometric technology and laser photothermal technology. Our non-destructive, non-contact metrology solutions cover critical parts of the semiconductor production process and relevant materials such as silicon, gallium arsenide, indium phosphide and silicon carbide.

Precitec offers high-precision measurement solutions for the following applications:

  • High-speed wafer inspection: Fast wafer sorting by TTV, bow and warp, even of challenging geometries
  • Wafer cleaning: Monitoring multiple wafer cleaning processes
  • Back end: Measuring adhesive thickness and micro-bumps and detecting voids in bonding
  • High-precision levelling and wafer & photomask alignment
  • Ceramic carbide coatings: Extending maintenance levels for a faster ROI

  Products

  • FLYING SPOT SCANNER
    High-Speed OCT Metrology for Semiconductor Quality Control – Precitec Flying Spot Scanner 310...

    • Flying Spot Scanner 310 + CHRocodile 2 IT
    Winner of the SPIE Prism Award 2023

    High-speed OCT system for precise measurement of distance, thickness, and topography.
    Rotary scanning replaces linear motion for unmatched speed and accuracy.

    Key Features:
    • Simultaneous TTV, bow, and warp data in one scan
    • No moving axes – robust, fast, and precise
    • Ideal for in-line semiconductor quality control

    Engineered for demanding metrology tasks where precision is critical.

  • LINE SENSORS
    CHRocodile CLS 2 – High-Speed Confocal Line Sensor for 3D Surface Metrology...

    • Precitec’s CHRocodile CLS 2 is a powerful confocal line sensor delivering fast, non-contact 3D measurements with submicron precision. Ideal for in-line inspection in semiconductor and electronics manufacturing, it captures full profiles at up to 384,000 3D points per second.

    Key Benefits:

    • High-speed acquisition for real-time process control
    • Precise 3D data on surface, thickness, and step heights
    • Robust, compact design for industrial integration

    Optimize quality control with reliable, high-throughput metrology.

Categories

1 FLEX
  • Sensors
    • 203 Inspection & Measurement Products
  • Defect; Particle; Contam. Detection/Review/Inspect.
  • Die Inspection; Die Shear
  • Film Thickness; Uniformity Measurement; Ellipsometer
  • Flat; Notch Finding System
  • Metrology; Topology; Nanotopography; Flatness; Cryst.Orient.
  • Package Inspection; Lead Scanners
  • Wire Bonding Inspection; Test
    • 208 Test Equipment
  • Optical Test Systems
  • PCB; Wire Board (PWB) Test and Repair
  • Probe Card Maintenance and Analysis Systems
  • Wireless, non-contact Test Systems
    • 400 Components, Parts & Accessories
  • Sensors

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