Suss MicroTec, Inc.

Corona,  CA 
United States
https://www.suss.com
  • Booth: 1341

Welcome to the virtual booth of SUSS MicroTec

Overview

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com

  Products

  • XBS300 W2W
    Permanent Wafer Bonding Platform for R&D and High-Volume Production...

    • The universal XBS300 W2W platform is designed for hybrid bonding of aligned 200 mm and 300 mm wafers. Its highly modular design offers maximum configuration flexibility at low cost- of -ownership for customers. Different configurations are available to meet the requirements in both R&D and high-volume manufacturing (HVM) environments. The new XBS300 hybrid bonding platform allows for both collective D2W (die-to-wafer) and W2W (wafer-to-wafer) hybrid bonding focusing on most demanding applications such as 3D stacked memory or 3D SOC (system-on-chip). 
  • XBC300 Gen2 D2W
    A Gamechanger in Enabling Further Interconnect Scaling...

    • Increase production capacity, minimize yield losses: XBC300 Gen2 D2W platform is your fully automated solution for sequential die-to-wafer hybrid bonding on 200mm and 300mm substrates.  The platform was engineered in close partnership with SET Corporation SA and meets the most demanding inter-die spacing requirements. An industry-leading footprint and post-bond accuracy of less than 200nm specifically address the requirements of advanced 3D IC architecture, especially for high-bandwidth memory applications. The XBC300 Gen2 D2W platform not only enables lower yield loss, as well as an increased purity, but also improves process control in manufacturing. 
  • JETx
    Inkjet Printing Solution for High Volume Production...

    • The JETx inkjet printer for high volume production is SUSS’s most advanced solution for printing functional materials, specifically designed for the semiconductor and adjacent markets, such as power electronics, sensors, MEMS, display and biomedical. 
    The JETx, combined with a material handling unit, such as the ACS200 Gen3 TE, and a hotplate stack offers a complete production solution designed for a low cost of ownership with high throughput for round wafers up to 300 mm and panels up to 24” by 30” (610 x 765 mm).

Categories

1 FLEX
  • Advanced Packaging
  • Processing & Manufacturing
    • 200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Litho for WLP: Bumping; 3D Interconnect Aligners
  • Wafer Level Bonders
    • 203 Inspection & Measurement Products
  • Metrology; Topology; Nanotopography; Flatness; Cryst.Orient.
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Bumping Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Coat; Develop; Resist Processing; Track Equipment
  • Lithography/Exposure
  • SOI Bonders; Temporary Bonders; De-Bonders
    • 701 Manufacturing Services or Consulting
  • Manufacturing Process Support and Development

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