TEL

Austin,  TX 
United States
http://www.tel.com
  • Booth: 6145

Categories

200 Packaging and Assembly Equipment
  • Dispensing Systems
  • Litho for WLP: Bumping; 3D Interconnect Aligners
  • Wafer Level Bonders
    • 201 Flat Panel Display Equipment
  • Alignment Film Coating Equipment
  • Luminous Layer Patterning and Sealing Equipment
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 206 PV Equipment
  • Thin Film
    • 207 Process Equipment
  • Bumping Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; (CVD, PVD, ALD, Plating)
  • Deposition; PVD; Sputtering; Evaporation Equipment
  • Epitaxy Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion; E-Beam Milling Etching Equipment
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
  • Thermal Processing
    • 208 Test Equipment
  • Probing: Analytical; Circuit; Manual; E-Beam; Optical; Wafer

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