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cyberTECHNOLOGIES GmbH

Eching,  Bavaria 
Germany
https://www.cybertechnologies.com
  • Booth: 1187

ADVANCED METROLOGY SOLUTIONS for Fab & Lab

Overview

cyberTECHNOLOGIES develops and manufactures high-end metrology systems for the semiconductor industry.

Its systems are used worldwide by IDMs, foundries, and OSATs, supporting high-volume production and R&D with reliable nano-resolution, high-speed measurements across the process chain from front- to back-end.

The portfolio spans from tabletop systems for labs and process qualification to fully automated, multi-sensor platforms with integrated sample handling — engineered for high-accuracy, throughput, and nonstop operation in fabs.

cyberTECHNOLOGIES solutions support a wide range of applications, including:

  • Wafer Warp, Bow
  • Laser groove (e.g. Width, Chipping)
  • Thickness & Thickness Variation (TTV / LTV)
  • Thinfilm (down to 10 nm)
  • Step Heights
  • (µ-)Bumps, Pins, Pads & Pillars (e.g. Coplanarity, Position)
  • Critical Dimensions
  • Die Attach (e.g. Tilt)
  • Chiplets (e.g. Parallelism, Rotation)
  • Fillet Height
  • 3D Wirebond (e.g. Sway, Clearance)
  • Probecards (incl. Rework)
  • Thermal Warpage Measurement
  • Transparent Films & Coatings
  • Thickfilm
  • Roughness

…and many more.

See you at booth #1187!

www.cybertechnologies.com


  Products

  • AL-Series - Fully Automated Wafer Metrology
    The AL-Series combines the power of one or two metrology systems with advanced automated wafer handling for 6'' up to 12'' wafer, purpose-built for high-throughput front-end applications....

  • The AL Series delivers high-throughput, fully automated wafer metrology designed for demanding semiconductor fabs.

    Optimized for speed and reliability, the systems feature dual dockable metrology cells with multi-sensor support, stainless steel housing, and optional FFU integration.

    Automated wafer handling includes magazine scanning sensors, parallel load/unload, and optional dual-arm transfer for maximum efficiency. Precision is ensured through advanced prealignment with integrated DMC reader, industrial ionizer, and  wafer handling.  Robust vibration isolation - semi-active or active piezo for WLI sensors - combined with a granite base guarantees measurement stability.

    The M-LINK software package enables ASCAN remote control, SECS/GEM automation, real-time 3D visualization, and intuitive touch operation, ensuring seamless integration into modern fab environments.
  • CT-Series - Versatile Metrology Systems
    Highly adaptable and customizable single- or multi-sensor metrology systems with nanometer resolution. Systems like the industry-standard CT300/CT350 integrate up to six different sensor technologies in a single system for a wide range of applications....

  • The CT Series combines high-accuracy and flexibility in metrology, offering single- and multi-sensor configurations with nanometer resolution. It delivers advanced measurement performance while adapting to a wide variety of applications.

    A range of system sizes is available, from compact table-top models to versions with scanning areas of up to 650 × 650 mm² for large panels. One system can be equipped with up to six different sensor technologies, providing a broad range of measurement options. Its adaptable design allows configuration for specific needs, such as conveyor belt or handler connection, custom interfaces, vacuum chucks and more.

    Specialized configurations such as the industry-standard CT300 and CT350 are widely used for substrates, JEDEC trays, boats, wafers up to 12", and other components within the system size. Double-sided models allow simultaneous measurement of top and bottom surfaces, delivering absolute thickness values in a single scan.

    For maximum efficiency, measurement processes can be fully automated, enabling consistent results and high throughput without operator intervention and SECS/GEM capability.

  • NAMIB-Series - Thermal Warpage Metrology
    The NAMIB Series performs thermal warpage measurements with nanometer resolution in just milliseconds and supports controlled heating and cooling cycles....

  • The NAMIB-Series provides high-resolution thermal warpage measurements with nanometer resolution, capturing each field of view within a few hundred milliseconds.

    This enables precise characterization of substrates, packages, dies, and other critical samples. With versatile heating concepts - hot plate, convection chamber, or specialized micro-heaters - NAMIB adapts to real application needs, from rapid temperature ramps to full reflow-like profiles.

    Users can design complex, repeatable heating cycles, seamlessly import or export profiles, and leverage automatic triggering at both stable and transient states. The outcome is fast, dependable warpage data across complete heating and cooling cycles, empowering advanced process development, material optimization, and robust quality assurance.

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