• Booth: 1850

Win a free Apple Airpod at Allwin21 booth 1850:Video DEMO

Overview

Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, & LED industries.

Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. Allwin21 is manufacturing the new AccuThermo AW Series Atmospheric Rapid Thermal Processors .Compared with traditional RTP systems, Allwin21″s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the best rapid thermal processing performance ( repeatability , uniformity and Stability etc.). For many years AG Associates was the dominant manufacturer of RTP systems. These AG RTP systems are still being used around the world in manufacturing, R&D and Universities. These RTP systems have a proven track record for reliability and simplicity.

  Press Releases

• Allwin21 Corp (USA) Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment (Aug 28, 2025)

  Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Atmospheric and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours.

  Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition, and Metal Film Metrology semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships.

  

• New production proven AccuThermo AW820R automatic single wafer Rapid Thermal Processor for Compound Materials (3 inch to 8 inch) - SiC, GaAs, GaN, InP, GaInP etc (Aug 28, 2025)

  The AccuThermo AW820R is production-proven stand alone atmospheric RTP (Rapid Thermal Processing) system, which uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-900 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the  heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

  AccuThermo AW820R Key Features:

  1. Long steady time capability RTP/RTA/RTO/RTN system with big
  2. stand alone frame and fans in the frame.
  3. 35 years’ production-proven Real RTP/RTA/RTO/RTN system
  4. Scattered IR light by special gold plated Al chamber surface.
  5. Allwin21 advanced Software package with real time control
  6. technologies and many useful functions.
  7. Consistent wafer-to-wafer process cycle repeatability.
  8. Top and bottom cross High-intensity visible radiation Tungsten
  9. halogen lamp heating for fast heating rates with good
  10. repeatability performance and long lamp lifetime.
  11. Cooling N2 (Or CDA) flows around the lamps and quartz isolation
  12. tube for fast cooling rates
  13. Elimination of external contamination by Isolated Quartz Tube
  14. Up to six gas lines with MFCs and shut-off valves
  15. Energy efficient.
  16. Made in U.S.A.
  17. Small footprint :54(D) X 39(W) X 70(H)
  18. Double O Ring for O2 sensitive applications
  19. O2 Sensor/Analyzer for O2 sensitive applications in production

  AccuThermo AW820R Software Key Features:

  1. Integrated process control system
  2. Real time graphics display
  3. Real time process data acquisition, display, and analysis
  4. Programmed comprehensive calibration and diagnostic functions
  5. Closed-loop temperature control with temperature sensing.
  6. Precise time-temperature profiles tailored to suit specific process
  7. requirements.
  8. Faster, easier Programmable comprehensive calibration of all
  9. subsystems, leading to enhanced process results.
  10. A recipe editor to create and edit recipes to fully automate the
  11. processing of wafers inside the AccuThermo RTP
  12. Validation of the recipe so improper control sequences will be
  13. revealed.
  14. Storage of multiple recipes, process data and calibration files so that
  15. process and calibration results can be maintained and compared over
  16. time.
  17. Passwords provide security for the system, recipe editing, diagnostics,
  18. calibration and setup functions.
  19. Simple and easy to use menu screen which allow a process cycle to be
  20. easily defined and executed.
  21. Troubleshooting feature which allows engineers and service personnel
  22. to activate individual subassemblies and functions. More I/O, AD/DA
  23. “expose”.
  24. Use PowerSum to save valuable compound material wafers
  25. Watchdog function: If this board looses communication with the control
  26. software, it will shut down all processes and halt the system until
  27. communication is restored.
  28. GEM/SECS II function (Optional).

• New AccuSputter AW4450 Sputtering Deposition Equipment for Compound Materials (2 inch to 8 inch) - SiC, GaAs, GaN, InP, GaInP etc (Aug 28, 2025)

  

  Manufacturer: Allwin21 Corp.

  Condition: New

  Wafer Size: Small~8 inch

  Wafer loading: Manual, with Load Lock

  Cathodes: 1~3 x Delta Shape  OR  1~4 x 8″ Circle Shape

  Sputter Methods: RF (RG VII: Air cooling 300W, 600W, 1000W, 2000W, 3000W)/ DC(Advanced Energy PNC3 6K , PNC3 10K)/ Pulsed DC (Advanced Energy PNC3 PLUS+ 5K, PNC3 PLUS+ 10K); Diode/Magnetron

  Gas Lines: 1~3 MFCs

  Table Rotate/Lift Subsystem: Feed-thru assembly (Option)

  Downloads: AccuSputter AW-4450 (PDF)

  Process proven for III-V, the AccuSputter® AW4450-Series Production Sputter Systems are manufactured in the configuration of a manually-loaded system capable of fully automatic (non-PLC) operation. The AccuSputter ® AW4450 sputtering head is equipped with three DeltaTM cathode or four round 8-inch positions.The AccuSputter ® AW4450-Series Production Sputter Systems deposit a wide variety of materials onto substrates such as ceramic, metal, plastics, glass and semiconductors. The system can also be used for RF sputter-etching, a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition. These sputtering systems sequentially deposit thin films of up to three or four different materials onto a single substrate, thus attaining sandwich-structured films such as multi-layer optical interference filters or semiconductor devices. Resulting thin films range in thickness from a few Angstroms up to several microns.

  • • • • • Process Chamber
          • Load lock
          • Vacuum System
          • Configuration and Specification
          • Facility Requirements

  Key Features

  • Process Proven for III-V substrates
  • Non-PLC (Smaller footprint / easy maintenance)
  • 20+ years proven sputter technology
  • New optimum AW-4450 System Control
  • Table Rotate/Lift Subsystem: Feed-thru assembly
  • DC 24V for Motors,Actuator,Relay,Solenoid
  • Efficient 8″ ,Delta cathodes, 2 to 6″ option
  • High throughput operation
  • High Uniformity and Yield
  • DC, RF Sputter, Pulse DC option
  • Magnetron and Diode Sputter option
  • RF Etch and Bias are optional
  • Ultra Clean vacuum system
  • Load lock operation
  • UHV design
  • Flexible for development or production use
  • Full range of substrate sizes and shapes
  • Various pumping and power options
  • Co-sputtering option
  • Reactive Sputtering option

  AW-4450 System Controller

  • Maintenance, Manual, Semi Automatic and Full Automatic operation modes
  • Automated calibration of all sub-systems
  • Troubleshoot to sub-assembly levels
  • Programmed comprehensive calibration and diagnostic functions
  • Recipe creation for full automatic wafer processing
  • Automatic decline of improper recipes and process data
  • Multi-level password protection
  • Storage of multiple recipes and system functions
  • Real-Time process data acquisition,display ,analysis
  • Real-Time graphics use display
  • Process Data and Recipe storage on a hard drive
  • Easy TC vacuum gauge calibration
  • Positioning Deposition(optional)
  • GEM/SEC II functions (optional)

  Products