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JET America Inc.

Irving,  TX 
United States
https://www.jet-wet.com/
  • Booth: 5546

Overview

JET is a leading manufacturer of semiconductor wet process equipment based in Okayama, Japan. We specialize in the development, design, manufacturing, sales, and maintenance of semiconductor cleaning equipment for pre-processing in semiconductor production. Unlike standard cleaning systems with limited customization, JET’s solutions are tailored to meet each customer’s exact requirements.

Our batch-type cleaning systems efficiently process wafers with highly flexible configurations, optimizing chemical usage and minimizing tool footprint. Additionally, our revolutionary single-wafer cleaning equipment features proprietary technology designed to meet the stringent demands of advanced semiconductor devices with smaller, more complex designs. This innovation enhances processing efficiency while reducing chemical consumption.

With a commitment to precision and innovation, JET delivers cutting-edge semiconductor cleaning solutions to manufacturers worldwide, ensuring superior performance and adaptability in an ever-evolving industry.

  Products

  • Model: HTS-300
    Single-wafer cleaning equipment for 300mm wafers: Uses just 150cc of chemicals, enables high-temp processing up to 240°C, completes strip process in 30 sec, prevents fume diffusion with wafer inversion, and offers full customization....

    • Single Wafer Cleaning Equipment

     

    Model: HTS-300

    Cleaning Process

    Single-wafer cleaning equipment designed for 300-mm wafers

    Key Features

    1. Achieves processing with minimal chemical consumption, utilizing only 150 cc
    2. Capable of high-temperature processing up to 240°C
    3. Strip process completed in as little as 30 seconds
    4. Effectively prevents fume (chemical vapor) diffusion through wafer inversion processing
    5. Customizable per customer’s requirements
    Contact Us

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Deposition; (CVD, PVD, ALD, Plating)
  • Deposition; PVD; Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
    • 701 Manufacturing Services or Consulting
  • Manufacturing Process Support and Development
  • Wafer Handling

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