Heidelberg Instruments

MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION

https://heidelberg-instruments.com/product/mla300/

The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.

Key Features

• High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
• Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
• Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
• Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

Applications

• Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
• Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
• MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
• Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
• Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
• Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection.
• Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
• OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.

Workflow and Cost Efficiency

• Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
• By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
• The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
• A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
• Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
• Modularity allows for quick maintenance, keeping downtime to a minimum.

Contact us: [email protected] to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.

MLA 150 Advanced Maskless Aligner

https://heidelberg-instruments.com/product/mla150/

The modern, maskless aligner replaces legacy technology with a fast, flexible, and remarkably easy-to-use solution engineered for the highest degree of performance. By using a digital mirror device (DMD) as a dynamic mask, the MLA 150 overcomes the drawbacks of physical photomasks. Go from a digital design to a perfectly patterned substrate in minutes, empowering your users to accelerate research in fields like quantum devices, MEMS, micro-optics, and life sciences.

Key Benefits

• No Photomasks Required: Pattern directly from digital designs using a dynamic mirror device (DMD).

• Fast Turnaround: Expose a full 150 mm wafer in under 16 minutes.

• Sub-Micron Precision: Achieve feature sizes down to 0.45 μm.

• User-Friendly Interface: Train new users in under an hour—ideal for shared lab environments.

Designed for R&D and Small Series Production, the MLA 150 is built for flexibility, making it the perfect tool for:

• Academic Research Labs

• Industrial Prototyping

• Small Batch Manufacturing

Applications include quantum devices, MEMS, micro-optics, and life sciences.

Advanced Capabilities

• Dual-Wavelength Exposure: Supports 375 nm and 405 nm lasers for compatibility with g-, h-, and i-line photoresists.

• Versatile Substrate Handling: Easily process small pieces (down to 3×3 mm²), thin foils, and warped wafers.

• Grayscale & High-Aspect-Ratio Modes: Create complex 2.5D structures and steep sidewalls for MEMS and microfluidics.

• Interactive “Draw Mode”: Directly draw and expose patterns on live camera images—ideal for quick prototyping and precise electrode placement.

Precision & Stability

• Automated Alignment: Achieve 250 nm accuracy with digital compensation for offset, rotation, and scaling.

• Dynamic Autofocus: Ensures sharp, uniform features across varied substrates.

• Environmental Control: Integrated chamber with temperature-controlled laminar airflow (±0.1°C) for consistent, repeatable results.

See why top universities and research centers worldwide have chosen the MLA 150 to replace their mask aligners. Contact us at: [email protected]

VPG 300 DI Maskless Stepper

VPG 300 DI Maskless Stepper | Heidelberg Instruments

The VPG 300 DI bridges the gap between R&D and production, offering sub-micron resolution and tight overlay accuracy comparable to traditional i-line steppers—without the cost and delays of mask procurement. Ideal for rapid prototyping, process development, and applications requiring frequent design iterations. From CAD to exposure in minutes, the system enables fast design transfer and daily iteration cycles, dramatically accelerating development timelines.

Key Benefits

• High-Speed Exposure: Custom SLM and optimized data path enable 100×100 mm² writing in just 9 minutes
• Stitching-Free Large Areas: Create large dies or devices without stitching errors
• Instant Design Changes: Modify CAD files and expose immediately—no mask handling required

Achieve Exceptional Feature Fidelity

Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.

• High Resolution: Reliably produce critical structures smaller than 500 nm.
• Superior Edge Quality: Achieve an edge roughness of less than 40 nm (3σ).
• Excellent CD Uniformity: Maintain tight process control with a CD uniformity of less than 50 nm (3σ).

Intelligent Tools for Complex Device Fabrication

From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.

• Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
• Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
• Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
• Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.

Discover how the VPG 300 DI can revolutionize your fabrication workflow. Contact us: 

[email protected]