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cyberTECHNOLOGIES GmbH

Eching,  Bavaria 
Germany
https://www.cybertechnologies.com
  • Booth: 1187

ADVANCED METROLOGY SOLUTIONS for Fab & Lab

Overview

cyberTECHNOLOGIES develops and manufactures high-end metrology systems for the semiconductor industry.

Its systems are used worldwide by IDMs, foundries, and OSATs, supporting high-volume production and R&D with reliable nano-resolution, high-speed measurements across the process chain from front- to back-end.

The portfolio spans from tabletop systems for labs and process qualification to fully automated, multi-sensor platforms with integrated sample handling — engineered for high-accuracy, throughput, and nonstop operation in fabs.

cyberTECHNOLOGIES solutions support a wide range of applications, including:

  • Wafer Warp, Bow
  • Laser groove (e.g. Width, Chipping)
  • Thickness & Thickness Variation (TTV / LTV)
  • Thinfilm (down to 10 nm)
  • Step Heights
  • (µ-)Bumps, Pins, Pads & Pillars (e.g. Coplanarity, Position)
  • Critical Dimensions
  • Die Attach (e.g. Tilt)
  • Chiplets (e.g. Parallelism, Rotation)
  • Fillet Height
  • 3D Wirebond (e.g. Sway, Clearance)
  • Probecards (incl. Rework)
  • Thermal Warpage Measurement
  • Transparent Films & Coatings
  • Thickfilm
  • Roughness

…and many more.

See you at booth #1187!

www.cybertechnologies.com


  Products

  • AL-Series - Fully Automated Wafer Metrology
    The AL-Series combines the power of one or two metrology systems with advanced automated wafer handling for 6'' up to 12'' wafer, purpose-built for high-throughput front-end applications....

  • The AL Series delivers high-throughput, fully automated wafer metrology designed for demanding semiconductor fabs.

    Optimized for speed and reliability, the systems feature dual dockable metrology cells with multi-sensor support, stainless steel housing, and optional FFU integration.

    Automated wafer handling includes magazine scanning sensors, parallel load/unload, and optional dual-arm transfer for maximum efficiency. Precision is ensured through advanced prealignment with integrated DMC reader, industrial ionizer, and  wafer handling.  Robust vibration isolation - semi-active or active piezo for WLI sensors - combined with a granite base guarantees measurement stability.

    The M-LINK software package enables ASCAN remote control, SECS/GEM automation, real-time 3D visualization, and intuitive touch operation, ensuring seamless integration into modern fab environments.
  • CT-Series - Versatile Metrology Systems
    Highly adaptable and customizable single- or multi-sensor metrology systems with nanometer resolution. Systems like the industry-standard CT300/CT350 integrate up to six different sensor technologies in a single system for a wide range of applications....

  • The CT Series combines high-accuracy and flexibility in metrology, offering single- and multi-sensor configurations with nanometer resolution. It delivers advanced measurement performance while adapting to a wide variety of applications.

    Customizable and adaptable by design, the systems can be configured to meet specific requirements. Up to six different sensor technologies can be integrated in a single platform, providing comprehensive measurement options in one streamlined system.

    A range of system sizes is available, from compact table-top models to versions with scanning areas of up to 650 × 650 mm² for large panels. Specialized configurations such as the industry-standard CT300 and CT350 are widely used for substrates, JEDEC trays, boats, wafers up to 12", and other components within the system size. Double-sided models allow simultaneous measurement of top and bottom surfaces, delivering absolute thickness values in a single scan. For maximum efficiency, measurement processes can be fully automated, enabling consistent results and high throughput without operator intervention and SECS/GEM capability .


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