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Camtek USA, Inc.

Beaverton,  OR 
United States
http://www.camtek.com
  • Booth: 1291

Overview

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek’s systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek’s systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry’s leading global IDMs, OSATs, and foundries.

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers’ requirements.

  Products

  • Hawk
    Designed for Cutting Edge Advanced Packaging: Chiplets, HBM and Hybrid Bonding Enabling inspection & metrology of 500M bumps at 6µm pitch, 2x faster throughput, and 150nm defect sensitivity!...

    • Developed on an innovative platform, the Hawk is designed  for cutting edge advanced packaging: Chiplets, HBM and Hybrid Bonding.

    The Hawk product line is a result of many years of dedicated research and development.

    The Hawk is tailored to meet the growing demands for inspection and metrology, from R&D to high-volume production.

  • Eagle G5
    40% Faster TPT, 300nm Precision — Optimized for Fanout and CIS Applications...

    • Developed on the well-known Eagle product family, the Eagle G5 is engineered to deliver unmatched speed and efficiency.​

    Significantly higher throughput

    New optimized optics

    Higher resolution for enhanced detection and metrology

    Innovative solutions for Multi-RDL, FOWLP, 2.5D, and CMOS Image Sensors

    Clear-Sight Technology (CSI) for Multi-Layer RDL

    • Enhanced detection capabilities down to 1.4μm L/S
    • 2X Higher Throughput (TPT)
  • MicroProf
    Best in Class Metrology...

    • MicroProf® AP is a fully automated wafer metrology tool for a wide range of applications at different 3D packaging process steps, e.g. for the measurement of photoresist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as for the measurement in thinning, bonding and stacking processes. With its modular multi-sensor concept, the flexible MicroProf AP measuring tool is ideally suited to perform various measuring tasks in advanced packaging.

    • Wafer surface topography down to one nanometer level
    • RDL less than 1.4um
    • TSV down to 2um diameter
    • TTV, BOW and Warp

Categories

203 Inspection & Measurement Products
  • Defect; Particle; Contam. Detection/Review/Inspect.
  • Die Inspection; Die Shear
  • Microscopes: Confocal Scanning; 3-D Video
  • Microscopes: Optical Microscopes
    • 206 PV Equipment
  • Inspection and Metrology

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