During semiconductor manufacturing, many key processes require the use of chillers to provide precise temperature control to ensure process stability, consistency, and yield. Here are some semiconductor processes that rely heavily on chillers:
1. Photolithography
Requirement:
The photolithography machine generates a lot of heat during the exposure process, especially when using deep ultraviolet (DUV) or extreme ultraviolet (EUV) light sources. Chillers are needed to cool the light source, optical system, and wafer stage to maintain stable exposure conditions.
Temperature control requirements: Temperature fluctuations must be controlled within ±0.1°C to ensure uniform exposure and pattern accuracy of the photoresist.
2. Etching
Dry etching:
During plasma etching, the electrodes and reaction chambers generate a lot of heat. Chillers are used to cool the electrodes and chambers to maintain stable plasma conditions and etching rates.
Wet etching:
The temperature of the chemical solution needs to be precisely controlled to ensure etching rate and uniformity. Chillers are used to cool or heat chemical baths.
3. Chemical Vapor Deposition (CVD)
In the CVD process, the reaction chamber and wafer need to be kept within a specific temperature range to control the deposition rate and quality of the film. The chiller is used to cool the reaction chamber, gas delivery system and heater.
Temperature control requirements: Temperature stability must be within ±0.5°C to ensure the uniformity and performance of the film.
4. Physical Vapor Deposition (PVD)
In the PVD process, the sputtering target and chamber generate heat. The chiller is used to cool the target and chamber to maintain stable deposition conditions.
Temperature control requirements: Temperature fluctuations must be controlled within ±1°C.
5. Ion Implantation
Ion implanters operate under high pressure and high energy conditions, which generates a lot of heat. The chiller is used to cool the ion source, accelerator and wafer stage to ensure stable operation of the equipment and process consistency.
Temperature control requirements: Temperature stability must be within ±0.5°C.
6. Chemical Mechanical Polishing (CMP)
During the CMP process, friction heat is generated between the polishing pad and the wafer. The chiller is used to cool the polishing liquid and the polishing pad to control the polishing rate and surface flatness.
Temperature control requirements: Temperature fluctuations must be controlled within ±1°C.
7. Diffusion
The diffusion furnace operates at high temperatures, but some components (such as the cooling chamber) need to be cooled. The chiller is used to cool the auxiliary systems of the diffusion furnace to ensure process stability.
Temperature control requirements: Temperature stability must be within ±1°C.
8. Cleaning
During the wafer cleaning process, the temperature of the chemical solution needs to be precisely controlled. The chiller is used to cool or heat the cleaning liquid to ensure the cleaning effect and wafer surface quality.
Temperature control requirements: Temperature fluctuations must be controlled within ±1°C.
9. Testing and Packaging
During the wafer testing and packaging process, the test equipment and packaging equipment generate heat. The chiller is used to cool the test probe station, packaging mold and other key components.
Temperature control requirements: Temperature stability must be within ±1°C.
10. Other auxiliary equipment
Other equipment in semiconductor manufacturing, such as vacuum pumps, lasers, and gas delivery systems, also requires cooling. Chillers are used to maintain stable operation of these equipment.