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Tesec Inc.

Gardena,  CA 
United States
https://www.tesecinc.com/
  • Booth: 5475

  Products

  • 530-IT
    530-IT is designed with a new concept that incorporates the idea of IC tester into the power devices measurement technology TESEC has accumulated over many years. It provides the optimized testing solutions for IPD/IPM....

    • Feature

    Utilized the measurement technology of testers for power discrete device.

    ・Maximum 2.2kV/67A (max 200A) measurement capability. Expandable by adding external units.
    ・Supports two device parallel measurements.
    ・Easy language-less test program creation (fill-in-the-blank method)
    ・High-speed leakage current measurement
    ・Various bias application waveforms and timing
  • 431-TT
    431-TT can measure the static characteristics of discrete semiconductor devices. With its high versatility, it can be used in various applications such as the wafer test when a prober is connected and the final test when a handler is connected....

    • Feature

    • VI Source Measure Modules Structure
    • Measurable up to 1.2 kV per 130A
      (maximum. 2.2 kV per 200A) on the main unit
    • High Speed Measurement
    • Multi-device test (2 DUT simultaneous measurement of 2 in 1 devices and etc.)
    • Wafer parallel test (2-chip simultaneous measurement)
    • On Screen Waveform Monitor
    • High Current Unit, High Voltage Unit as option
  • 5170-IH
    5170-IH can test the leadless devices such as QFN,BGA and WLCSP diced on the wafer ring. It is capable of hot and cold temperature test....

    • Feature

    ・High throughput 
    ・High withstand load and high thrust table 
    ・Maximum Strip Attachment Area: 300 mm(L) × 300 mm(W) [⌀300 mm for WLCSP]
    ・LOT control with barcode/2D code reader 
    ・Easy device type conversion — test socket replacement and display screen setting
    ・Auto-cleaning function of socket with programmable timing
    ・6/8/12 inches ring conversion 
    ・SEMI S2/S8 compliant
    ・SEMI G85 compliant
    ・SECS/GEM compliant
    ・Highest test temperature: 155℃
    ・Lowest test temperature: −45℃
    ・Upgrade from the ambient temperature system to the temperature control system is available at the installed location.

Categories

1 FLEX
  • Processing & Manufacturing
  • Technical Services
    • 100 Electronic System Design
  • Test Tools and Services
    • 208 Test Equipment
  • Discrete Component Test Systems
  • Handlers; Positioner Systems
  • Package Test Systems
  • Parametric Test Systems
  • PCB; Wire Board (PWB) Test and Repair
    • 309 Test Materials
  • Test Sockets; Contactors and Contact accessories

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