Rehovot, Israel – August 26, 2025 – Nova (Nasdaq: NVMI), today announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been specifically designed to address the complex requirements of the most advanced packaging applications in semiconductor manufacturing.
The Nova WMC represents a breakthrough in optical metrology, designed from the ground up as a completely new proprietary system. This platform stands out for its exceptional versatility, enabling it to seamlessly handle a wide range of wafer sizes and forms – including traditional and framed wafers—while supporting multiple metrology technologies in a modular manner. Thanks to this adaptability, WMC is well-positioned to meet the evolving needs of 2.5D and 3D advanced packaging processes and is uniquely equipped to deliver robust solutions for significant industry inflection points, such as hybrid bonding. With its comprehensive capabilities, WMC empowers manufacturers to solve emerging challenges, cementing its potential as a cornerstone tool for next-generation packaging applications.
The platform has already been adopted by one of the world’s leading memory manufacturers for High Bandwidth Memory, and several additional orders have been placed by manufacturers of logic, advanced memory, and power devices. The strong demand for Nova WMC stems from the platform’s unique ability to address major challenges such as high warpage, non-symmetric shapes, and different surface conditions in a single tool, with high throughput, and fast, repeatable scanning with large-area mapping at nanometer fidelity. The company has already recognized revenue for the first system and received orders for multiple systems, for which it expects to recognize revenue by the end of 2025.
“We are excited to introduce the Nova WMC to our customers,” said Gaby Waisman, President and CEO of Nova Ltd. “This innovative platform provides manufacturers with the precision and flexibility they need to stay ahead in rapidly evolving advanced packaging manufacturing processes. The Nova WMC is a testament to our commitment to deliver cutting-edge solutions that seamlessly adapt to evolving process demands.”