GigaMat Technologies, Inc.

GigaMat Technologies, Inc. is a worldwide supplier of wafer‑processing equipment. We design and manufacture single‑wafer, multi‑head CMP systems and batch‑process CMP systems supporting 100–450 mm wafers on a single‑platform architecture with interchangeable carriers. Our tools handle any wafer shape, thicknesses from 100 µm to 5 mm, and materials including SiC, glass, sapphire, silicon, diamond, ULE glass, germanium, GaAs, lithium niobate, InP, and II‑V compounds. Specialty applications include Via‑Middle copper CMP, M10/M12 PV panels, and 210×210 mm / 310×310 mm glass packaging. Options include dry‑in/wet‑out/dry‑out automation, slurry delivery and pH control. GigaMat also provides wafer metrology systems for thickness, TTV, bow/warp, site flatness, resistivity, OCR, wafer mapping, and optical/capacitive non‑contact sensing with nanometer resolution. Automated robotic or belt systems support 50–300 mm wafers.

GigaMat Technologies, Inc. is a worldwide supplier of wafer‑processing equipment. We design and manufacture single‑wafer, multi‑head CMP systems and batch‑process CMP systems supporting 100–450 mm wafers on a single‑platform architecture with interchangeable carriers. Our tools handle any wafer shape, thicknesses from 100 µm to 5 mm, and materials including SiC, glass, sapphire, silicon, diamond, ULE glass, germanium, GaAs, lithium niobate, InP, and II‑V compounds. Specialty applications include Via‑Middle copper CMP, M10/M12 PV panels, and 210×210 mm / 310×310 mm glass packaging. Options include dry‑in/wet‑out/dry‑out automation, slurry delivery and pH control. GigaMat also provides wafer metrology systems for thickness, TTV, bow/warp, site flatness, resistivity, OCR, wafer mapping, and optical/capacitive non‑contact sensing with nanometer resolution. Automated robotic or belt systems support 50–300 mm wafers.