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Nordson Test & Inspection

Minneapolis,  Minnesota 
United States
https://www.nordson.com/en/divisions/test-and-inspection
  • Booth: 5844

Visit Nordson Test & Inspection at booth 5745

Overview

Nordson Test & Inspection manufactures world-class metrology and inspection systems & sensors. Our inspection metrology equipment meets the highest standards for electronic assembly and semiconductor applications. Acoustic, Optical, Bond Test, X-ray Components, Manual X-ray, and Automated X-ray systems enable you to identify even the smallest defects at high resolution and capture critical measurements. Wireless Semiconductor Sensors can significantly improve semiconductor tool setup and maintenance.

We design, develop, and manufacture innovative inspection & metrology equipment for a wide range of industries, including AI, Server & 5G, Consumer, Automotive, Power & Energy, Sensors & LED, Aerospace & Defense and Medical.

Our key segments include Advanced SMT, Advanced Packaging, Front-End semiconductor, Mid-End semiconductor, and Back-End semiconductor.

  Press Releases

  • Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California.
     

    Highlighting the exhibition will be the worldwide debut of the new SonoFlex™ Acoustic Microscopy Inspection (AMI) System, an innovative platform designed to redefine acoustic inspection performance for back-end advanced semiconductor manufacturing.
     

    In addition to SonoFlex, Nordson will showcase a broad range of advanced inspection and metrology solutions designed to enhance yield, process control, and productivity across front-end, mid-end, and back-end semiconductor manufacturing operations.

  • Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will feature two new systems designed to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications. 

    On exhibit will be the new ASYMTEK Vantage XL system, designed to meet throughput and yield demands driven by AI, high-performance computing, and advanced semiconductor packaging applications. Plasma experts will be available to discuss the new MARCH ExoSPHERE and how it enables PLP operations for higher throughput and lower manufacturing costs. Together, these systems help manufacturers accelerate process development and scale advanced packaging production with greater efficiency and control. 

  Products

  • SonoFlex™ Acoustic Microscopy Inspection (AMI) System

    5040b8f541fdbfe64da3fa1aa223bc03-huge-ami-sonoflex-gradient.jpgCombining breakthrough ThruScan imaging technology with intelligent AI-powered analytics, SonoFlex delivers exceptional image quality, highly accurate defect detection, and significantly increased throughput for small-panel applications. The system incorporates advanced pulser and transducer technologies that enable scanning speeds up to twice as fast as conventional solutions while maintaining high-resolution imaging performance.
     

    Its modular architecture simplifies maintenance and serviceability while enabling scalable multi-system configurations capable of increasing throughput by up to eight times. Powered by FlexCore™ software and Nordson’s N-Intelligence Multi-Gate Image Analysis (MGIA) technology, SonoFlex automatically identifies defects, isolates true void counts, and supports complex device and process analysis. The result is improved product quality, greater manufacturing efficiency, and deeper process insight through advanced acoustic inspection and imaging capabilities.
     

    ...

  • Semiconductor Front-End Solutions Demonstrated

    Nordson will d1185e3f462a028ec6eb70627798e588-huge-ws-ags2-white.jpgdemonstrate its WaferSense® AGS2 and ACS wireless metrology sensors designed for capturing and analyzing real-time data for effective semiconductor tool set-up and maintenance. The ACS “sees” inside equipment to capture dimensional offset data (x,y and z) to quickly center wafer transfer positions. The AGS2 speeds non-contact gap measurements and parallelism adjustments under vacuum, improving uniformity, tool availability and repeatability in a thinner and lighter form-factor.

    ...

  • Dynamic Planar CT Elevates AXI Performance

    14a933be500d40d27d2eddf3ae76790b-huge-dynamic-planar-ct.png
    Dynamic Planar CT is Nordson Test & Inspection's next-generation 3D Planar X-ray technology designed to enhance automated X-ray inspection (AXI) performance. Leveraging an advanced reconstruction algorithm, it delivers superior image quality, improved layer separation, and enhanced defect visibility. With a larger field of view and up to twice the image acquisition speed of conventional Planar CT solutions, Dynamic Planar CT helps manufacturers increase throughput while reducing radiation exposure. The technology is ideally suited for advanced semiconductor applications, including flip-chip and micro-bump inspection.

    ...

Categories

1 FLEX
  • Advanced Packaging
  • AI & Data Analytics
  • Inspection & Test
  • Sensors
    • 100 Electronic System Design
  • Machine Learning and AI Tools, Software, and Application Providers
  • Test Tools and Services
    • 201 Flat Panel Display Equipment
  • Photolithography; backplane, Color Filter and TP
    • 202 Other Equipment
  • Vibration Isolation Systems
    • 203 Inspection & Measurement Products
  • Microscopes: Optical Microscopes
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 206 PV Equipment
  • Inspection and Metrology
  • Wafers
    • 207 Process Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography/Exposure
    • 208 Test Equipment
  • Optical Test Systems
  • PCB; Wire Board (PWB) Test and Repair
  • Wireless, non-contact Test Systems
    • 300 Packaging and Assembly Materials
  • Lead Frames & Headers: Etched; Stamped
    • 400 Components, Parts & Accessories
  • Sensors
    • 401 Sub-systems
  • Temp. Sensing; Control; Recirculators; Chillers; Heat Exch.
    • 402 PV Systems
  • Measurement and Control Technology
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • Clean Rooms
    • 602 Manufacturing Software
  • Test Programs
    • 700 Manufacturing Services
  • Calibration & Reference Standards
  • Etch; Strip; Cleaning Service
  • Lithography; Patterning service
  • Measurement; Inspection Service
  • Wafer Bumping Service
    • 701 Manufacturing Services or Consulting
  • Assembly
  • Wafer Handling

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