Exosens

MERIGNAC,  France
https://www.exosens.com/

• Booth: 6752

WELCOME TO BOOTH 2082!

Overview

At SEMICON West, Exosens a world leader in revealing the invisible and will showcase advanced imaging technologies purpose-built for advanced semiconductor inspection and in-line monitoring. Our advanced imaging portfolio spanning from UV to LWIR, addressing machine vision and industrial inspection needs, including high precision inspection, laser monitoring, semiconductor manufacturing, 3D printing, food sorting and related applications. UV and SWIR imaging solutions enable reliable detection of contaminants, defects, and material variations in high speed food sorting environments. To know more contact us at [email protected]

  Press Releases

• Seeing the Unseen: SWIR in Sorting applications (Jun 24, 2026)

  Visible light cameras cannot see everything that matters. Ejecting organic versus non-organic material on sorting equipment such as clear plastic from a potato stream or grading peaches by sugar content, identifying different fabrics for clothes recycling (nylon vs wool); conventional systems consistently fall short. Compositional differences, sub-surface defects, and moisture gradients are invisible in the 400–700 nm band that human eyes inhabit.

  SWIR imaging (900–1700 nm) reveals material differences based on molecular properties like water, fat and protein content, rather than just surface color. This enables high-contrast sorting, making SWIR the preferred sensor for infrared food inspection, recycling, and industrial quality control.

• Wafer Inspection at Advanced Nodes (Jun 24, 2026)

  The Growing Challenge of Patterned Wafer Inspection

  Semiconductor wafer inspection has become a defining factor for yield, reliability, and time-to-market. As devices shrink, patterned wafer inspection becomes more difficult due to dense layouts and complex structures that reduce visual contrast. This allows critical defects to blend into intended features.

  Dark‑field inspection is an optical inspection technique used in semiconductor manufacturing that detects defects by capturing scattered light rather than reflected light. 

  Traditional bright‑field approaches often struggle to reveal certain defect types, making alternative inspection modes essential.