
DediProg Technology today announced the launch of its new UltraConduct™ Rubber Pin Test Socket. Featuring DediProg's patented PCR × Pogo Pin hybrid contact structure, the solution combines low contact resistance, high-frequency signal integrity, solder ball protection, and long-stroke warpage compensation to address the growing demands of AI/HPC IC testing.
UltraConduct™’s Key Technologies
- Low Contact Resistance: Patented PCR × Pogo Pin hybrid structure delivers <50mΩ contact resistance and stable high-frequency signal transmission.
- 0.6mm Long-stroke Design: A 0.6mm compression stroke maintains 20g ±20% contact force, ensuring reliable contact for large BGA packages while reducing mechanical stress.
- Flexible, Mark-free Contact: The flexible PCR interface leaves no probe marks, protects solder balls, and helps reduce SMT defects and rework.
- High Temperature Resistance: Reliable electrical and mechanical performance from -55°C to 150°C supports demanding thermal test environments.