Chung King Enterprise Co.,Ltd

• Booth: 6186

We’re looking forward to your visit.

Overview

CKplas is the world’s only supplier of automated transport carrier equipment spanning four major industries: semiconductors, LED, TFT-LCD, and solar energy. With extensive experience in providing optimal storage, protection, and transportation solutions for high-tech products such as precious metals, reticles, masks, wafers, and glass, CKplas is well-equipped to meet the evolving demands of the global AI wave and advancements in semiconductor processes. The company leads the way in offering advanced packaging solutions, including 2.5D, 3D, CoWoS, and FOPLP automated transport carriers and equipment. CKplas quickly adapts to market changes, delivering top-notch product design and development capabilities. Furthermore, it is dedicated to integrating the broader semiconductor supply chain, offering services such as automation equipment integration, Class 1 wafer cleaning service, micro-contamination prevention, and ion contamination detection.

  Press Releases

• CKplas Unveils Next-Generation Carriers (Jul 14, 2026)

  CKplas Group (中勤) is set to showcase its capabilities ahead of SEMICON Taiwan 2025, actively promoting its Panel FOUPs made of high-durability composite materials. These carriers are specifically designed for highly integrated Panel-level Packaging (PLP), heterogeneous integration, and other diverse automated mass production scenarios.

  The Panel FOUP features advanced polymer composite materials, an integrated one-piece airtight design, and is available in multiple specifications (GL-PF524 / GL-PF536 / Quarter / MP FOUP). It supports mainstream and specialized dimensions, including 510x515mm and 248x248mm, making it ideal for cutting-edge processes such as PLP, CoWoS, AI, high-frequency communications, Glass Through Via (TGV), and copper substrates. Supported by innovative airflow control and smart sensing tracking, the system efficiently prevents micro-contamination, enabling comprehensive capacity and quality management.

  At the same time, CKplas’s EFEM (Equipment Front End Module) smart front-end technology has already become a standard configuration for international customers' mass production. Although there will be no physical EFEM unit on display at the exhibition, all Panel FOUP carriers are fully compatible and seamlessly dock with EFEM automated machinery.

  The EFEM systems supplied by CKplas support the SECS/GEM communication protocols and NACHI robotic arms. They feature low-vibration transmission (<0.3G), SEMI S2 safety standard certification, CFD flow field optimization, smart identification, and automatic lid opening. These capabilities assist production-line clients in seamlessly implementing automated transport, precision processing, and full-process Industry 4.0 data management—meeting the latest ISO Class high-cleanliness specifications and the diverse process needs of multi-equipment setups.

  From silicon materials and glass substrates to heterogeneous stacking composite processes, CKplas’s Panel FOUP and EFEM solutions can be precisely customized to enhance production line flexibility and automation efficiency, deeply empowering smart semiconductor manufacturing and quality control.

  We sincerely invite industry professionals to visit Booth K2466, Hall 1, Taipei Nangang Exhibition Center from September 10 to 12 to discuss high-end carrier technologies, consult on diverse process applications, and build a new paradigm of automated, clean, and highly reliable semiconductor mass production.