3D-Micromac AG

Our field-proven microPREP^® systems accelerate sample preparation for a wide range of failure analysis methods, including TEM, SEM, APT, XRM, and micromechanical testing. The latest development, the microPREP^® L, can prepare specimens on bigger samples like 12” wafers or system-level boards. These can even be prepared across multiple areas of the same sample in a single run, without process restarts.

Free your FIB/SEM for what it does best – speed up your time-to-sample with laser-based sample preparation with microPREP® systems.

Magnetic sensors are a key enabling technology for automotive, industrial, consumer and emerging medical/HMI applications. Driven by demand for higher sensitivity, lower power consumption, smaller footprints and greater integration, TMR sensors are gaining relevance.

Translating this potential into monolithically integrated sensor layouts – from Wheatstone bridges to angle and multi-axis concepts – requires local definition of sensor sensitivity axes at wafer level. Selective laser-based reference-layer pinning provides this capability by combining a selective laser spot with a local magnetic field, allowing defined sensor areas to be pinned in the desired direction – with additional relevance for GMR sensors.

microVEGA™ xMR is a production-proven platform used in 24/7 high-volume fabs worldwide. It combines localized thermal impact, recipe-based flexibility and on-the-fly processing for cost-efficient production of next-generation TMR/GMR sensor architectures.

Laser Link Trimming (LLT) enables permanent hardware configuration for analog, power-management and mixed-signal ICs in automotive, industrial, aerospace and other high-reliability applications. Typical devices include gate drivers, BMS ICs and high-side switches, where LLT supports variant configuration and permanent hardware limits for safety-critical and fail-safe functions.

Complementing rewritable NVM, Trim-DACs and electrically programmed OTP solutions, LLT creates irreversible, tamper-resistant configurations by modifying predefined metal links – without electrical programming stress or the need for dedicated memory structures.

microVEGA™ FC enables high-throughput wafer-level LLT on a production-grade platform for semiconductor manufacturing, combining ±200 nm positioning accuracy (3σ), closed-loop process control and on-the-fly processing at up to 400 mm/s for an exceptional balance of speed, precision and process stability.