ADVANCED METROLOGY SOLUTIONS for Fab & Lab
Overview
cyberTECHNOLOGIES develops and manufactures high-end metrology systems for the semiconductor industry.
Its systems are used worldwide by IDMs, foundries, and OSATs, supporting high-volume production and R&D with reliable nano-resolution, high-speed measurements across the process chain from front- to back-end.
The portfolio spans from tabletop systems for labs and process qualification to fully automated, multi-sensor platforms with integrated sample handling — engineered for high-accuracy, throughput, and nonstop operation in fabs.
cyberTECHNOLOGIES solutions support a wide range of applications, including:
- Wafer Warp, Bow
- Laser groove (e.g. Width, Chipping)
- Thickness & Thickness Variation (TTV / LTV)
- Thinfilm (down to 10 nm)
- Step Heights
- (µ-)Bumps, Pins, Pads & Pillars (e.g. Coplanarity, Position)
- Critical Dimensions
- Die Attach (e.g. Tilt)
- Chiplets (e.g. Parallelism, Rotation)
- Fillet Height
- 3D Wirebond (e.g. Sway, Clearance)
- Probecards (incl. Rework)
- Thermal Warpage Measurement
- Transparent Films & Coatings
- Thickfilm
- Roughness
…and many more.
See you at booth #1187!
www.cybertechnologies.com