Evatec AG

Trubbach,  St. Gallen 
Switzerland
http://www.evatecnet.com
  • Booth: 1945

Welcome to the thin film powerhouse - packaging excellence

Overview

Evatec delivers complete thin film production solutions for Advanced Packaging, Semiconductor, Optoelectronics and Photonics. Choose from our range of batch, cluster and inline platform architectures for deposition of metals, TCOs, piezoelectrics, dielectrics, magnetics and a whole range of compounds. Our team is ready to deliver tailored production solutions according to your process, throughput and fab integration requirements. At this year's Semicon you can learn all about out latest packaging solutions - from PVD solutions for wafer warpage correction and low temperature PVD of SiN and SiCN for hybrid bonding applications on CLUSTERLINE 300 , to all the latest features on CLIUSTERLINE 600 enabling advanced IC substate processing at panel level. Our team is ready to welocme you at booth 6654.


  Products

  • BAK EVAPORATORS

    With new levels of flexibility, and new levels of process control the BAK Evaporator is the industry leader in selected applications across Power Device, Wireless, LED, MEMS and Photonics applications. There is a BAK thats suitable for everyone - from the compact BAK 501 for universities and research institutions to the Multi BAK 1401 for large volume manufacturing.  

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  • CLUSTERLINE® FAMILY

    CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all 6 Evatec core markets.

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  • HEXAGON

    System design for the lowest Rc in the industry

    HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering atmospheric pressure degas, etch and metal deposition.

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