Greetings! We look forward to meeting you at booth 564!
Overview
Enabling Reliable Semiconductor Manufacturing Through Advanced Materials
Semiconductor manufacturers face increasing demands for process reliability, contamination control, thermal management, advanced packaging performance, and sustainability.
At SEMICON West, AGC will showcase materials and technologies supporting semiconductor manufacturing across the value chain:
Contamination Control & Process Reliability
• Post-CMP Cleaner
• FORBLUE™ Membrane for ECD
• High-purity fluoropolymers (PFA, ETFE, FFKM)
Advanced Packaging & Electronic Materials
• ETFE Mold Release Film
• EA2000 low dielectric fluoropolymer
• Fine silica fillers for PCB, substrate, and underfill applications
Thermal Management
• Heat Transfer Fluids
Sustainability & Circularity
• AGC Fluorine Recycle Initiative
Visit AGC at SEMICON West to discuss the materials helping enable the next generation of semiconductor manufacturing.