Finetech - Simply Accurate
Overview
Finetech offers sub-micron die bonders for advanced packaging and micro assembly – flip chip, opto-e, sensors, photonics, MicroLEDs, C2W, Cu pillar, Chip on Glass, and more. Process flexibility within one platform makes these systems ideal for R&D environments and prototype to production – thermo-compression, -sonic, eutectic, epoxy, high force, ACF/Indium bonding. Manual, motorized and fully-automated production bonders are available. Finetech also provides advanced rework systems for today's challenging applications.