Overview
Fusion Bionic is a German deep-tech company specializing in high-speed laser surface functionalization for advanced manufacturing. Our technologies enable precise micro- and nanostructuring to improve adhesion, bonding, thermal performance, wettability, friction and optical properties—without additional coatings or chemicals.
For the semiconductor industry, we develop solutions for advanced packaging, bonding and debonding, underfill optimization, thermal management, and functional surface preparation of wafers, carriers and substrates.
Based on Direct Laser Interference Patterning (DLIP) and complementary laser processes, we combine high throughput, precision and scalability. From feasibility studies and process development to system integration and industrial production, Fusion Bionic helps semiconductor manufacturers create high-performance surfaces and bring innovative processes into series manufacturing.