Overview
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide.
We currently hold the No.1 global market share in the TC BONDER market for HBM, a core component of AI semiconductors, and have also maintained the No.1 global position for 23 consecutive years in micro SAW & VISION PLACEMENT (mSVP), which are essential back-end semiconductor equipment.
[Product Line-up]
1. HBM TC BONDER
: TC BONDER 4.5 GRIFFIN / TC BONDER 4.0 TIGER / TC BONDER 1.0 GRIFFIN SB / TC BONDER 1.0 TIGER / HBM 6-SIDE INSPECTION 1.0
2. 2.5D TC BONDER
: 2.5D TC BONDER 120 / 2.5D TC BONDER 40 C2S / 2.5D TC BONDER 40 C2W / BOC COB BONDER
3. FC BONDER
: FC BONDER 3.5 / FC BONDER 3.0 / FC BONDER 5.0 / FC BONDER 75
4. VISION PLACEMENT
5. micro SAW
6. EMI SHIELD
: 'EMI Shield 2.0 X' series for aerospace and Low Earth Orbit (LEO) satellite communications
7. META GRINDER
8. LASER