AlumiPlate® is a 99.99% pure, fully dense, void-free electroplated aluminum coating engineered for demanding plasma-facing FEOL semiconductor applications. The coating acts as an effective diffusion barrier, preventing substrate contaminants and corrosion products from entering the process environment.
Designed for Cl- and F-based plasma chemistries, AlumiPlate® provides excellent corrosion resistance, helps reduce damaging heat effects from plasma recombination, and maintains performance at temperatures up to 450°C.
Its high purity and dense structure enable superior oxide formation through anodization and Plasma Electrolytic Oxidation (PEO). Compared to anodized Al 6061, anodized electroplated aluminum delivers:
- Higher purity oxide
- Void-free structure
- Higher dielectric strength
- Significantly improved plasma corrosion resistance
- Up to 10× better HCl bubble-test performance