Overview
The semiconductor portfolio of Lapmaster Wolters includes precision sawing, grinding, lapping and polishing technologies specifically designed for the processing of silicon (Si) and SiC wafers. Supporting both single-sided and double-sided processing, Lapmaster Wolters systems deliver the precision, repeatability, and surface quality required for demanding semiconductor applications. Typical applications include the manufacturing of logic and memory chips, power devices, advanced packaging substrates, and sensors.