Features： In-line design Applicable to hundreds of product sizes. Variety of tracks to achieve multi-product operations. Wafer-level MFC to prevent gas leakage (high-risk gases like hydrogen  can be used). High sealing cavity within 5pa. Water contact angle <10° (depends on surface material) ... Learn More

Features： Applicable to 4, 6, 8 inch wafers (1~3 generation semiconductors) Precision robotic arm, pick and place accuracy 0.05mm Highly sealed cavity design, 4pa~10pa Microwave + quartz gas path design, glue removal uniformity 2~5% FFU effectively reduces dust pollution Single reaction chamber, small footprint High efficiency stripe rate, >40000A/min ... Learn More

Advantages： Small size. PLC/PC control and supports multiple mainstream communication protocols. SEMI certified. 4-channel design, UPH 350~450. Compatible 100+ product sizes and magazines. Quick switch to products of different sizes. Wafer-level MFC prevents safety accidents caused by gas leakage (high-risk gases such as hydrogen can be used). High sealing cavity within 5pa Water contact angle <10° (depends on surface... Learn More

Features： Applicable to hundreds of product sizes. Multi-channel gas for a variety of gases Wafer-level MFC to prevent safety accidents caused by gas leakage (high-risk gases such as hydrogen can be used). Cavity high sealing design up to <6pa Water contact angle <10° (depends on surface material). Low operate temperature <40°C ... Learn More