LNEYA Thermo Refrigeration Co.,Ltd.

For a single IC or other components among many components, it can be isolated for high and low temperature impact, and the impact rate of temperature changes is faster. Within 10 seconds, the temperature can achieve a periodic change of 150°C~-55°C.

Compared to the traditional thermostat, there are several features:
Temperature range: -120 °C ~ +300 °C;
The temperature rise and fall is very fast, -55 °C ~ 150 °C < 10 seconds;
Temperature control accuracy: ±1 °C;
Temperature setting capability: ±0.1 °C;
Temperature display capability: ±0.1 °C;
Maximum air flow: 25m3/h;
Real-time monitoring of the real temperature of the IC under test to achieve closed-loop feedback and adjust the gas temperature in real time;
The temperature rise and fall time is controllable, programmable operation, manual operation and remote control.

Parameters Detailed

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85°C to +200°C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.

  LNEYA represents the international advanced liquid temperature control technology, actively explores and studies component testing systems, mainly used for temperature test simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -92°C ~ 250°C, suitable for various Test Requirements. LNEYA is committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can be cooled directly from 300°C.

TES -45℃~250℃ 

TES -85℃~200℃

Parameters

Product Description

The refrigerant in the refrigeration system is directly output and evaporated into the target control element (heat exchanger) for heat exchange, thereby cooling the target control object. The heat exchange capacity is generally more than 5 times higher than that of the fluid (gas) transported into the heat exchanger, which is especially suitable for applications where the heat exchange area of the heat exchanger is small but the heat exchange is large. It can also be used such as gas capture, the refrigerant is directly passed into the trap to evaporate, and through the condensation effect on the surface of the trap, it is quickly inferior to the gas in the air.

Product Applications

Main Parameters