NIDEC ADVANCE TECHNOLOGY CORPORATION

Muko-shi,  Kyoto 
Japan
https://www.nidec.com/jp/nidec-read/
  • Booth: T1345

Credibility built on market-proven technology.

Overview

NIDEC ADVANCE TECHNOLOGY has been established in 1991 and distributed test solutions which evaluates wire conductivity on the surface of printed circuit board. When printed circuit board does not work properly, the mounted components on the board also will have a problem to play their roles. Therefore, NIDEC-READ believes that our established inspection & measurement technologies have an effect on electric components and final products as well as printed circuit board itself.
Born out of the need for high-speed, high-accuracy measurement/ inspection of fast-evolving electronic components, NIDEC ADVANCE TECHNOLOGY products reflect the culmination of our longstanding experiences in a variety of elemental technologies. Our technical portfolio today realizes extensive application in:
- mission-critical, high-performance integrated circuits and associated software
- hardware design enabling submicron control
- component fixture operation for processing and assembling multi-pin and narrow-pitch chips, and
- two- and three-dimensional optical imaging and three-dimensional process technology
NIDEC ADVANCE TECHNOLOGY’s main strength derives from the ability to blend a wide range of elemental technologies to the industry's highest level of performance.
・Automatic Test Equipment: NIDEC ADVANCE TECHNOLOGY GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA). NIDEC ADVANCE TECHNOLOGY offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. NIDEC ADVANCE TECHNOLOGY provides open/leak inspection system for touch screen panel and LCD, at singulated size to multifaced size, making use of our diversed contact & non-contact technologies.
・Automated Optical Inspection Equipment: NIDEC ADVANCE TECHNOLOGY's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within photomasks and inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.
・Probe Card: Our probe cards are a perfect solution for advanced wafer testing challenges.


  Products