GMP series micro diamond powder, It is suitable for efficient dicing and grinding in the semiconductor field. It is a professional raw material for the manufacture of diamond dicing knives, diamond wire saws and semiconductor grinding tools. Provide the most efficient solution for cutting, grinding and thinning semiconductor materials.
Diamond slurry adopts original special American technology, and customizes different processes according to professional requirements to solve the problems in the processing process of silicon carbide wafers.