ニューフレアテクノロジー

・50kV acceleration voltage and 3.6A/㎠ current density

・About 500,000 beams for realizing high-speed writing of EUV masks and complex curvilinear patterns

・Virtual beam size technology for middle-grade mask fabrication with higher productivity

・NPI-8000 is a leading edge mask inspection tool with Die-to-Database and Die-to-Die inspection modes for 10/ 7nm node.

・60min high-speed inspection(100mm square area).

・Proven on advanced photomasks, including EUV.

・Litho Plane Inspection function(option), CD-Map

8 inch single wafer technology

・High throughput with robot wafer handling and 50μm/h of high growth rate

・Independent temperature control of IN and OUT heaters

High Performance

・Thickness uniformity:≦2%(σ), Doping uniformity:≦5%(σ)

・Low downfall defect density