CDP Series
Characteristics
It is produced according to the general standard of conventional application field, which ensures the products to meet the national standard and the requirements that customers concerned most such as PSD, purity, good shape and oversize particles control.
Applications
Conventional saw cutting, lapping, grinding, polishing and diamond products.
FDP Series
Characteristics
Improved from the long life type of CDP series, using a variety of methods for post-processing which ensure round particles, L/D ratio is close to 1, without irregular shape, oversize particles are removed completely, surface purity up to ppm level and good dispersibility.
Applications
Conventional saw cutting, lapping, grinding and polishing, high-precision cutting, grinding and polishing in specific field. It can be used as the raw materials of diamond tools, diamond paste and slurry.
SFDP Series
Characteristics
It inherits all the advantages of FDP products. Using high quality diamond raw materials and round corner processing of particle surface which greatly improved the specific surface area and tap density of products. Along with a series of special post-processing technique, the total metal and silicon impurities of product surface is controlled below 100ppm. Super low conductivity makes excellent dispersibility of whole series of products.
Applications
It is used for high-precision cutting, grinding, polishing and high-end products field which has higher requirements for the shape, PSD, purity and dispersibility of products.
HDP Series
Characteristics
Choosing high grade, high strength diamond as raw materials and inherited a lot of advantages from them, these series boast extremely low internal impurity, low magnetism, high Ti, combined with our mature FDP processing technology the products have high efficiency and long life.
Applications
High-end PDC, TSP, metal bond products, vitrified bond products and electroplating diamond products etc.