SiC substrate laser slicing equipment is an equipment based on SPARC laser technology to achieve efficient slicing of silicon carbide substrate, which can achieve precise positioning, uniform processing and continuous slicing of SiC ingots. The equipment is suitable for SiC substrate processing of different thicknesses and sizes, providing a revolutionary solution for SiC substrate production, effectively reducing SiC material slicing loss, improving processing speed, and helping the SiC substra