Heidelberg Instruments Mikrotechnik

Heidelberg,
Germany
https://heidelberg-instruments.com/

小間番号5436

ホーム
出展製品

Experience the power of direct writing.

Heidelberg Instruments is a world leader in the development and production of high precision laser lithography systems, maskless aligners and nanofabrication tools. With over 35 years of experience and an installation base of more than 1,400 systems worldwide at industrial customers and in academic facilities, we provide lithography solutions specifically tailored to meet all micro- and nanofabrication requirements of our customers, for the production of binary layouts and complex 2.5 and 3D structures in micro-optics, photonics, microfluidics and nanobiotechnology, electronics and communication technology and in materials science. Industry leaders in the fields of MEMS, BioMEMS, ASICS, TFT, displays, micro-optics, sensors, semiconductors/advanced packaging and automotive are among our customers.

出展製品

MLA 300 MASKLESS ALIGNER FOR VOLUME PRODUCTION

The MLA 300 Maskless Aligner integrates seamlessly into fully automated production lines with resolutions down to 1.5 µm. Areas of application are advanced semiconductor packaging, IR sensors, MEMS, electronic probes, high-precision electronic components.... More Info Less Info

MLA 300 Maskless Aligner

Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning

Product Highlights

Direct-write Lithography

No mask-related costs, effort, or security risks

Flexibility

Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

Time-saving

Shorter time from prototyping to production. Digital design management replaces conventional mask library

Exposure Quality

Optical compensation of scaling, rotation; patented substrate tracking technology

Dynamic Autofocus

Superior critical dimensions (CD) uniformity on warped or corrugated substrates

Exposure Speed

300 x 300 mm2 in 19 minutes

Full Facility Integration

Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)