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Saito Optical Science

misato-cho senboku-gun,  Akita-ken 
Japan
https://saito-os.com/
  • Booth: 6404


Please drop in on us if you are interested in CMP process.

【Support a wide range of materials from glass to advanced crystalline materials

We have accumulated technologies as a glass substrate polishing company for optical and electronic components, and are currently expanding our business in the processing resistant material’s field such as oxide single crystals, sapphire, SiC for power devices, GaN, and diamonds.

High-precision processing is possible with either double-sided or single-sided polishing processes

We have both the double-sided polishing process used in the optical field and the single-sided polishing process used in the semiconductor field, enabling us to provide high quality, high flatness processing to meet your requirements.


 Products

  • Ultra-precision polished semiconductor wafers
    SiC, GaN and Diamond wafers with atomic-level smooth surfaces...

  • Wide bandgap semiconductors such as SiC, GaN, and Diamond are materials with excellent properties. On the other hand, these materials are difficult to process. Furthermore, their surfaces must be atomically smooth. We have achieved ultra-smooth finishing of wide bandgap semiconductor wafers with our accumulated CMP technology.