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HeNan Union precision Material

Zhengzhou,  Henan 
China
http://www.union-diamond.com
  • 小間番号7830


Professional Manufacturer of Diamond Powder

We focus on and serve the fields of integrated circuits, third-generation semiconductor silicon carbide, consumer electronic sapphire, optical glass, photovoltaic silicon wafer materials and other fields. Products include fine abrasives, fluid abrasives, and diamond series lapping pads.
We have successively passed the certification of ISO9001, ISO14001 &ISO 45001 systems.
We set up ultra-precision grinding and polishing application laboratory and nano-diamond powder materials engineering technology research center, possess key technology in high-grade cleaning, particle control and dispersion modification of nano, micron grade powders, got multiple inventive patents. 
Since its establishment, the company has paid attention to standardized management, it has passed ISO9001, ISO14001 and ISO 45001 system certifications. The product quality, environment, occupational health and safety are strictly enforced.
Our main products: monocrystalline diamond powder, polycrystalline diamond powder, detonated nano Diamond, diamond suspension and diamond lapping pad.


 出展製品

  • Synthetic Diamond Powder
    Monocrystalline diamond powder, selects high quality synthetic diamond as the raw material, adpots different production processes and product standards according to the requirements of different industries and application fields....

  • CDP Series
    Characteristics
    It is produced according to the general standard of conventional application field, which ensures the products to meet the national standard and the requirements that customers concerned most such as PSD, purity, good shape and oversize particles control. 
    Applications
    Conventional saw cutting, lapping, grinding, polishing and diamond products.
    FDP Series
    Characteristics
    Improved from the long life type of CDP series, using a variety of methods for post-processing which ensure round particles, L/D ratio is close to 1, without irregular shape, oversize particles are removed completely, surface purity up to ppm level and good dispersibility.
    Applications
    Conventional saw cutting, lapping, grinding and polishing, high-precision cutting, grinding and polishing in specific field. It can be used as the raw materials of diamond tools, diamond paste and slurry.
    SFDP Series
    Characteristics
    It inherits all the advantages of FDP products. Using high quality diamond raw materials and round corner processing of particle surface which greatly improved the specific surface area and tap density of products. Along with a series of special post-processing technique, the total metal and silicon impurities of product surface is controlled below 100ppm. Super low conductivity makes excellent dispersibility of whole series of products. 
    Applications
    It is used for high-precision cutting, grinding, polishing and high-end products field which has higher requirements for the shape, PSD, purity and dispersibility of products.
    HDP Series 
    Characteristics
    Choosing high grade, high strength diamond as raw materials and inherited a lot of advantages from them, these series boast extremely low internal impurity, low magnetism, high Ti, combined with our mature FDP processing technology the products have high efficiency and long life.
    Applications
    High-end PDC, TSP, metal bond products, vitrified bond products and electroplating diamond products etc.
  • Diamond Lapping Pad
    Diamond Lapping pad belongs to the category of consolidated abrasive grinding technology....

  • Diamond Lapping pad belongs to the category of consolidated abrasive grinding technology. Based on a specially designed pad structure, it is made of diamond powder and resin, and can be used in the lapping and thinning process of hard and brittle materials such as glass substrates (microcrystalline, quartz, borosilicate, white board, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), piezoelectric terminals (lithium tantalate), and precision ceramics (aluminum oxide, aluminum nitride, silicon nitride).