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Takano

Chiyoda,  Tokyo 
Japan
https://www.takano-net.co.jp/portal/field/image_inspection/
  • Booth: 5221


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Takano is a trusted maker in the field of inspection technology, proudly manufacturing all our products in Japan to uphold the renowned quality of Japanese craftsmanship.

Beginning in 1987, when Takano first released its original brand of image processing inspection equipment, we have been constantly striving to improve the functionality and appliactions of our products. Takano now offers a state-of-the-art lineup ranging from Wafer Surface and Visual Inspection, IC package inspection, FPD inspection, film inspection, battery-related material inspection system and and others.

With an extensive global network of sales and service centers, Takano ensures swift responses to customer needs, delivering reliable support and innovative solutions that drive satisfaction and excellence worldwide.

 Products

  • WM Series: Particle Inspection System
    High Sensitivity Particles Detection on Non Patterned Wafers High Cost Performance Inspection Solution...

    • WM Series is essential for semiconductor device manufacturing, material development, and equipment management.
    With the ability to detect nano-level particles (foreign matter), it is widely utilized both in Japan and overseas.
    The system uses a semiconductor laser as its light source, effectively reducing running costs.

    *CE, SEMI Standard compliant

    More details here

  • Vi Series: Pattern Inspection System
    Flexible and Adaptable for Various Inspection....

    • High accuracy inspection of wiring patterns, cracks, foreign matter contamination, etc.
    Tailoring to customers' needs, Takano offers 5 different lineups depending on wafer size, device, type of defect, etc., and required inspection speed.

    More details here

  • Thinspector: Surface Film Thickness Inspection
    From Spot Measurement to Whole Surface Film Thickness Measurement...

    • With only ONE scan, film thickness measurement and unevenness inspection can be performed quickly over the entire wafer, enabling precise film thickness control.
  • ALTAX Series: Height Inspection System
    All Surface Height, Micro-bump Inspection System...

    • This system measures the height, diameter, and coplanarity of bumps formed on package substrates such as semiconductor wafers, BGAs, and CSPs at high speed and with high accuracy. The use of an optical system that has been independently improved and a data processing method (Time Delay Scanning) enables high-precision measurement that is not possible with the conventional light-section method.
    More details here
  • HAWEYES Series: Film Optical Inspection System
    In line High Speed, High definition Film Inspection System...

    • The Hawkeyes series features in-house developed cameras, image processing units, and inspection algorithms, delivering high-speed, high-precision inspection for the high-performance film market, including optical, electronic, and battery components.

    More details here

Categories

203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
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