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Gudeng Precision Industrial

New Taipei City, 
Taiwan
http://www.gudeng.com.tw
  • 小間番号2922

Wafer Handling Solution

  • 510mm x 515mm Full Panel FOUP
  • 300mm FOUP
  • 200mm Wafer Cassette & Shipping Box
  • 200mm Wafer SMIF Pod

Reticle Handling Solution

  • EUV POD
  • Reticle Cases
  • Reticle SMIF Pods

Services

  • FPD/ Mask /wafer carrier cleaning service
  • Customized Contamination Test


 プレスリリース

  • Gudeng Precision Industrial Co., LTDは、12月11日(水)~13日(金)にかけて、東京ビックサイトで開催される『SEMICON Japan 2024』に出展いたします。

    是非この機会に、Gudengの最新技術および製品をご覧いただきたく、心よりご案内申し上げます。

    何卒ご来場賜り、貴重なご意見を賜りますようお願い申し上げます。

    - 記 -

    日 時 2024年12月11日(水)~13日(金)1000~1700

    会 場 東京ビッグサイト

    展示ブース 東展示棟 Hall2 小間番号2922

    Webサイト https://www.semiconjapan.org/jp/

    -実機展示-

    未来の技術を支える運送対策

    マスク運送対策

    EUV POD

    RSP200/RSP150

    レチクルケース

    ウェハー運送対策

    E185 Tape Frame Cassette

    510mm x 515mm Full Panel FOUP

    600mm x 600mm Full Panel FOUP

     以 上

    【ご注意】

    ご来場の際は、展示会Webサイトから事前登録していただきますようお願いいたします。

    【お問い合わせ先】

    Gudeng Precision Industrial Co., LTD 顧客パートナーシップ処 営業担当

    e-mail︓ [email protected]/[email protected]/[email protected]

    webサイト︓ https://www.gudeng.com/


 出展製品

  • 510mm x 515mm / 600mm x 600mm Full Panel FOUP
    Provides high-efficiency protection for 510x515mm and 600x600mm Panel during transportation and storage....

  • Provides high-efficiency protection for 510x515mm and 600x600mm Panel during transportation and storage. 
    All dimensions are in compliance with SEMI specifications and can be customized according to machine parameter settings to ensure compatibility between the FOUP and machine. 
    The robust materials are chosen to reduce the risk of panel being damaged during production.

    ˙Size: 510mm x 515mm Panel and 600mm x 600mm Panel

    ˙Material: Polycarbonate

    ˙Slot: 12/16

  • 300mm FOUP
    Provides high-efficiency protection for 300mm wafers during transportation and storage....

  • Provides high-efficiency protection for 300mm wafers during transportation and storage. 
    Excellent air tightness and purge function can maintain the FOUP chamber in a clean and low-humidity environment. 
    Low outgassing and low moisture absorption materials can effectively reduce the risk of wafers being contaminated due to outgassing. 
    All dimensions are in compliance with SEMI specifications and can be customized according to machine parameter settings to ensure compatibility between the FOUP and machine.

    l   Size: 300mm (12 in.)

    l   Material: Polycarbonate 

    l   Slot: 13/25

  • EUV POD
    The dual-layer design of the box provides high-efficiency protection for the transportation and storage of 6-inch EUV reticles between process stations....

  • The dual-layer design of the box provides high-efficiency protection for the transportation and storage of 6-inch EUV reticles between process stations.
    The inner EIP can be operated in a vacuum environment.
    Supports purge function to control the temperature and humidity of the micro-environment inside the reticle carrier box.

    ˙Size: 6 x 6 x 0.25 (in.)

    ˙Material: PEEK (ESD), Metal

    ˙Usage: Support purge function

    ˙Application: Suitable for EUV process (ASML Certification)

  • Reticle SMIF Pod RSP200
    Provides high-efficiency protection for transportation and storage of 6-inch reticles between process stations....

  • Provides high-efficiency protection for transportation and storage of 6-inch reticles between process stations. 
    The integrated upper cover design is easy to clean and the use of wear-resistant and high-clean materials reduces the risk of particle gereration.
    The large transparent window is easy to view the internal reticle information.

    ˙Size: 6 x 6 x 0.25 (in.)

    ˙Material: Low moisture absorption & Super clean material

    ˙Application: Support 200mm SMIF standard mechanical interface

  • Film Frame FOUP / Tape Frame FOUP
    Provides 300mm wafer frame with high-efficiency protection during transportation and storage....

  • Provides 300mm wafer frame with high-efficiency protection during transportation and storage.

    Low-outgassing material can effectively reduce the risk of wafers being contaminated due to outgassing.

    Size

    300mm (12 in.)

    Material

    PC(ESD)

    Piece

    13 Piece