Toray Precision

Specifications (Demo Model)

• Hole Diameter: φ50µm / φ80µm

• Workpiece Size: 200mm square

• Flatness: 3µm

• Material: SUS304

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  Customizable Specifications

• Max. Hole Diameter: φ50µm / φ80µm

• Max. Workpiece Size: 800 × 800mm

• Flatness: Approx. 3µm

• Surface Roughness: Ra 0.1µm or less

• Applicable Materials: Various metals (Please contact us for details.)

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  Features

• Precise Micro-Holes Down to φ20µm

• Ultra-Flat Surface

• Suitable for Thin Films and Wafer Transfer

Our precision apertures are beam-shaping components for lithography and electron beam systems.
We provide highly accurate circular holes, slits, and complex opening patterns that help improve beam uniformity and reduce flare and stray light.

Available materials include high-melting-point metals such as molybdenum (Mo), tantalum (Ta), and tungsten (W), ensuring stable performance under high thermal load conditions.
Aperture size, shape, and layout can be fully customized to meet your system requirements and target beam profile. Please contact us for tailored designs.

Our molding tooling is used in semiconductor package encapsulation processes, where it directly affects package geometry and visual quality.
We manufacture precision molds with tightly controlled cavity geometry, flatness, and surface roughness, helping reduce warpage, flash, and short shots.

We can machine fine pins and narrow-pitch grooves for advanced package designs such as QFN, BGA, and LGA.
Material selection and surface treatments (coatings) can be proposed according to your operating conditions and lifetime requirements.

We offer metal 3D printed cooling parts produced by combining additive manufacturing (such as powder bed fusion) with high-precision machining and grinding.
By integrating internal cooling channels and realizing conformal cooling that follows the contour of the molding surface, these parts help equalize temperature distribution and shorten cycle times.

Critical surfaces are finished by 5-axis machining and grinding to achieve the required dimensional accuracy, flatness, and surface roughness, ensuring reliable integration into actual tools and equipment.
These cooling components are suitable for injection molds, semiconductor manufacturing equipment, and power devices where efficient heat removal is essential.

Our mirror finishing service combines ultra-precision grinding, lapping, and polishing to produce high-quality surfaces required for optical mirrors and stage components.
We aim for nanometer-level surface roughness while maintaining excellent form accuracy and flatness, helping reduce scattering on reflective surfaces and improve stability on scanning surfaces.

We can process various metals and selected ceramic or hard-brittle materials.
Optimal process conditions are proposed according to your workpiece size and required specifications. Please contact us when you need high-precision surfaces for optical, metrology, or semiconductor-related components.