We will present a hybrid processing sample that combines laser processing machines with machining centers,
and introduce the latest processing technologies for silicon and ceramic components used in semiconductor manufacturing equipment at SEMICON Japan 2025.
Laser processing machines make the impossible possible!
Laser processing machines expand the possibilities of ceramic processing.
- Water-guided laser processing machines LB300 / LB500
- Specializing in through-hole drilling and cutting of thick ceramic plates
- Ultra-short pulse laser processing machine LF400
- Specializing in micro-hole processing
Tackling ceramic processing with machining centers!
We will exhibit processing examples using various machining centers, including the BG500 optimized for brittle material processing.
- Stable hole processing at Φ 0.1 mm (Alumina) BG500
- Mirror finish below Ra 10 nm (SiC) DA300 Brittle Material Package Specification
- High-efficiency hole processing utilizing ultrasonics (SiC) V56i Brittle Material Package Specification
Product Introduction Page: BG500 | Makino
Product Introduction Page: LB300 | Makino
Machining Video: Machining Video: https://youtu.be/RCz4MLlaD3Q
Product Introduction Video: LUMINIZER LB300 / LB500 - YouTube
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