AVACO

- Multi-purpose ultra-purity metal films manufacturing system by strictly controlling the film

  properties such as logic, memory application & advanced package in semiconductors

- A flexible system for mixing and matching chambers to apply multi-step

  process sequence

- Demonstrates high reliability and provides more CoO benefits

- Feature & Properties

• Wafer Size: 12“(300mm) & 8”(200mm)(6”available)
• Tandem(or Single) octagonal cluster system
• Standard Configuration: EFEM(VCE for 8/6”) + LL + Transfer + Degas + Preclean(Etch) + Process

 Detailed System Configuration depends on the applied process

• Uniformity(Film/Etch): ≤ 3%(depends on THK) for film,  ≤ 5% for preclean

PlasmaLine is a equipment for process development and small scale production of

high-density multilayer board and IC board products for PCB,

where it provides high throughput by forming desmear & etch and

copper seed layer using plasma and also various configurations

are possible depending on the application.

· Precision ultrashort pulse laser glass process for advanced packaging technologies

· Unrivaled speed enabled by Dual Optical Heads targeting TGV mass production

· High aspect ratio hole formation

· Spatially designed long uniform Bessel beam creating micro channels

· Enabling fast etch for Through-Glass via (TGV)

· Capable of glass panels up to 510mm x 515mm, 0.3 ~ 1.1t