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SVCS

Brno,  Czech Republic
http://svcs.com
  • Booth: C104

Frontend Semiconductor Manufacturer from the Heart of Europe

Overview

                                                                                                                      

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Our experience is based on a long history and tradition of the semiconductor industry in former Czechoslovakia, in a place called the Czech Silicon Valley. 

For over 26 years we have been striving towards development of the tomorrow’s tools and tomorrow’s process innovations. To do this successfully, we cooperate with leading R&D laboratories, universities and scientific institutes.

The company’s headquarters and production plant are located in the Czech Republic. However, have world wide network of business representatives, more info at svcs.com/contacts.

SVCS has delivered installations for customers all over the Planet, for example: Australia, Belgium, Denmark, France, Germany, China, India, Japan, Korea, Lithuania, Malaysia, Mexico, Poland, Slovakia, Sweden, Taiwan, UK and the USA.

ISAC Research is our official distributor in Korea. 

        


  Products

  • Horizontal Furnaces
    Designed for High Performance in Production Environment while stays Efficient and Economic...

  • Features and Benefits

    • Maintenance friendly mechanical design
    • State of the art modular control system, in-house designed and manufactured
    • 10,4“ high-res touchscreen for operator interface
    • Up to 4 stacked quartz or SiC tube reactor chambers for various procesess
    • No thermal interference between different tubes
    • Contactless fully automated boat-in-tube loading both cantilever or softlanding configurations
    • Independent tube level control system
    • HW safety interlocks independent on main CPU
    • HEPA or ULPA filtres installed in load station
    • Boat elevator and wafer handling automation
    • UHP face seal fittings and welds for connections
    • UHP orbital weldings made in 100/10 Cleanroom

    Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Wet Oxide with ultra pure steamer
    • Dry Oxide
    • HiPOx (High Pressure Oxide)

    LPCVD Processes

    • Silicon nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    PECVD Processes

    • Silicon nitride (incl. anti-reflective SiN solar cell coating)
    • Silicon oxide
    • Oxinitride


    DCE or HCl optional for all processes

    Wafer Handling Automation

    Partial automation

    • Stand-alone cassette to boat wafer transfer system

     

    Full automation

    • Boat elevator
    • Fully automated stocker with built-in elevator and wafer transfer system


    Typical configuration for Boat Elevator is 5 boats each with 50 slots each (200 mm wafers) and 6 boats (150 mm wafers).

    In case of stocker, the system includes built-in wafer handling robot and the boat elevator. The stocker is integrated into the horizontal furnace and stores loaded and unloaded cassettes for a smooth continuous and fully automatic furnace operation.

  • Vertical Furnaces
    Configurable for Production or R&D Applications...

  • SVCS Vertical Thermal Reactor (VTR) is designed for all standard atmospheric and low pressure CVD processes. VTR is available with several lengths of flat zone for both mass production and R&D application. The single tube set-up with dual boat logistics is optimized for minimum down time as well as  low maintenance costs.

    Features and Benefits

    • Automatic wafer handling system for loading wafers from SMIF or FOUP closed pods
    • Special automatic loading system which allows loading wafers from open cassettes and provides an exceptionally small footprint
    • Quartz or SiC boats can be used 
    • Highly tailored state of the art modular control system, in house designed and manufactured
    • 10,4“ high-res touchscreen for operator interface 

    Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Dry Oxide

    LPCVD Processes

    • Silicon nitride / low stress nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    DCE or HCl optional for all processes

  • Compact Tabletop Furnaces
    Unique Compact Design, All Features of the Grown-up Furnace...

  • The SVCS Tabletop Furnace system provides a semiconductor grade quality tool for universities, R&D laboratories and pilot fabs. This system can be used for wide range of processes due to outstanding flexibility and amount of optional modules available to meet special and often unique requirements of every customer.

    Atmospheric Processes

    • Diffusion (drive-in) high temperature procesess
    • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
    • Various thermal processing e.g. annealing, sintering
    • Pyrogenic Wet Oxide with External Burning System
    • Wet Oxide with ultra pure steamer
    • Dry Oxide
    • HiPOx (High Pressure Oxide)

    LPCVD Processes

    • Silicon nitride
    • Low temperature oxide (LTO)
    • High temperature oxide (HTO)
    • TEOS oxide
    • Polysilicon, with tilt/flat temperature profile
    • Doped polysilicon
    • Oxynitride

    PECVD Processes

    • Silicon nitride (incl. anti-reflective SiN solar cell coating)
    • Silicon oxide
    • Oxinitride

    DCE or HCl optional for all processes

    Features and Benefits

    • Ideally suited for R&D labs and pilot fabs
    • Small footprint
    • Table or standalone solution (with stands)
    • Stackable desing (e.g. double tabletop variant)
    • Low power consumption
    • Easy operation and maintenance
    • Heating element with 1 or 3 temperature zones and max. temperature up to 1300 °С
    • Modern modular proprietary control system
    • Up to 8 gas lines and 2 liquid sources
    • Independent hardware safety interlocks
    • Integration of vacuum pump systems in cooperation with leading pump manufacturers
  • Ultra High Purity Gas Delivery Systems
    Gas Cabinets, VMBs, Gas Panels, Gas Jungles and other delivery Systems...

  • SV Deli

    • Gas Cabinets for 1, 2 or 3 cylinders
    • Valve Manifold Boxes (VMBs) for supplying multiple tools
    • Bulk Speciality Gas Systems (BSGS)
    • Gas Systems for various wafer production equipment
    • Customs designed R&D panels

    Gas cabinet configuration

    • Open, wall mounted systems (for inert gases)
    • 1 cylinder cabinet, with purge gas from external source
    • 2 cylinder cabinet
      • 2 process gas cylinders, with purge gas from external source and automatic changeover
      • 1 process gas cylinder, 1 purge gas cylinder
    • 3 cylinder cabinet (2 × process + 1 × purge), with automatic changeover

    Control system features

    • Fully automatic control system with TouchScreen display
    • Automatic cycle purging
    • Cylinder pressure or cylinder weight monitoring
    • Pressure transducer for output pressure monitoring
    • Excess flow switch
    • Programmable cylinder pressure or weight limits for automatic changeover
    • External digital inputs and outputs
    • Multiple level password protection for various operation modes
    • Ethernet interface for LAN connection

    Specifications

    • Orbital welded gas panels, manufactured and assembled in the class 10/100 clean room
    • Tubing, fittings, valves, pressure regulators, filters, flow devices and MFCs with either metal face or butt weld connections, surface roughness Ra max 10 µinch or better
    • 100 % helium leak test and functional test of all individual components prior to welding and panel assembly
    • Helium leak test after welding and panel assembly
    • Very low internal volume of the gas panel achieved by using special miniature weld heads
    • Compact internal vacuum generator for cycle purging

    Optional

    • Tailored gas panel according to specific customer request
    • Pigtail purging manifold (“deep-purge”)
    • Monitoring of dangerous gas presence
    • Pressure monitoring in the coaxial tubing outer containment
    • Additional particle filtering and/or purifying of both process and purge gas
    • Analytical testing services and certification for particles, moisture, oxygen and total hydrocarbons
  • High Temperature Furnaces
    New SiC furnaces with temperatures up to 1800° C...

  • Temperatures up to 2000°C Hermetically sealed loading area Controlled atmoshpehe loadlock chamber Vacuum processes Touchscreen operator interface placed on cleanroom wall Automatic wafer handling system for loading wafers | Unique temp. measurement by spike and profiling TC combine with pyrometry 7 independent water cooling circuits with the flow rate and temp. monitoring