AVACO

- Multi-purpose ultra-purity metal films manufacturing system by strictly controlling the film

  properties such as logic, memory application & advanced package in semiconductors

- A flexible system for mixing and matching chambers to apply multi-step

  process sequence

- Demonstrates high reliability and provides more CoO benefits

- Feature & Properties

• Wafer Size: 12“(300mm) & 8”(200mm)(6”available)
• Tandem(or Single) octagonal cluster system
• Standard Configuration: EFEM(VCE for 8/6”) + LL + Transfer + Degas + Preclean(Etch) + Process

 Detailed System Configuration depends on the applied process

• Uniformity(Film/Etch): ≤ 3%(depends on THK) for film,  ≤ 5% for preclean

- Precision ultra-shot laser glass process for advanced packaging

- High aspect ratio micro-channel TGV formation

  - Micro crack free

  - High speed glass panel patterning

- Support various glass types

PlasmaLine is a equipment for process development and small scale production of

high-density multilayer board and IC board products for PCB,

where it provides high throughput by forming desmear & etch and

copper seed layer using plasma and also various configurations

are possible depending on the application.